Buried via
A via connects only the two inner layers of the stack, leaving the outer copper layers untouched.
A via connects only the two inner layers of the stack, leaving the outer copper layers untouched.
A signal pulse crosses a microstrip trace above a ground plane at a constant, undistorted speed.
Two length-matched, serpentine traces carry a paired signal along their full run in exact lockstep.
Each pad of a component footprint lights in turn as a continuity scan checks the pattern before placement.
Copper pour hatching lights in sequence around a component, filling the plane from corner to corner.
A highlight scans down through a board's copper layers and back up, reading the stack from top to bottom.
A v-score between two boards on a panel scores through, and the finished board separates cleanly.
Copper plating draws down both walls of a drilled via, joining the top and bottom pads.
A print head travels beneath a component footprint, laying down its reference marking as it goes.
A stencil lowers over three pads, deposits solder paste through its apertures, then lifts clear.
The four relief spokes joining a pad to the copper pour light in rotation, tracing the thermal path.
A trace draws itself from pad to pad, turning around a component footprint to complete the connection.